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    :: HF13.56MHZ Card >> Smart card Mifare Ultralight-C HF blank card
HF blank card
- Dimensions: CR80 85.60 x 53.98mm
- Thickness: 0.84 +- 0.02mm
- Material: PVC (option: PET, PC, PET-G)
- Card Surface: Matt/ glossy finish
- Housing: Lamination
- Offset Printing
- Silkscreen Printing
- Magnetic stirp HICO, LOCO
- Thermal print

Blank card EX-factory Price:
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NFC Forum

An smart cards agreement was signed by both NFC Forum and EMVCo, the EMV standards body owned by American Express, JCB, MasterCard and Visa, to improve the development and testing process of NFC-enabled mobile devices.
Under the partnership, the two organizations will synchronize their specifications, test plans, test tools, laboratory accreditations and the management of contactless product certifications. This will reduce product time-to-market and decrease certification costs for EMV-related NFC products in the contactless payments industry, according to EMVCo.
The organizations’ activity will focus on Level 1 functionality, which covers contactless communication protocol. Initial efforts will center on outlining the scope of work and the specifications to be covered, followed by a gap analysis to identify and examine specification differences, agree on specification updates and determine how agreed amendments will be collectively managed.
“To enable contactless to reach its full potential and facilitate the delivery of secure payment solutions, we need to create an efficient testing and certification framework that allows products to be swiftly brought to market,” said Joe Cunningham, Chair of the EMVCo Executive Committee. “Alignment between industry bodies is therefore essential to ensure we apply specialist knowledge and a cohesive approach to the creation of this very innovative ecosystem.”
“We contactless cards want to make it fast and affordable for organizations to build and deploy EMV-based NFC solutions,” added Koichi Tagawa, NFC Forum Chairman. “By working closely with EMVCo, we’re able to better support vendors while furthering our commitment to global interoperability.”

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